短流程工艺能力 · Short Loop Process

 T&R Process Capability

 晶圆级测试 CP Test

 分选  T&R 

·具备切割前及切割后测试能力

·Ability to test before and after

·At present, it mainly adopts two kinds of mechanical cutting and laser hidden cutting

·Support wafer materials:：Glass/Si/EMC/LT/LN/SiC/GaN etc.

·The laser hides glass and silicon wafers facing narrow cutting paths

·Workable wafer size：4寸/6寸/8寸/12 inch

·Control: chip size/edge breakage after cutting

切割 Dicing

减薄 Backside Grinding

史密斯(Smith)圆图

测试设备组合

薄膜探卡示意图