产品优势：

·小型化、超薄、高可靠性

·应用于射频收发模组

·大规模量产

晶圆级芯片封装 · WLCSP

SAW-WLP（RDL)

SAW-CSP Chip

SAW-WLP Chip

SAW-WLP/CSP

SAW-CSP  Chip

SAW-WLP(Filling)

Advantages：

·Compact,ultra-thin,high reliability

·Applied to RF transceiver modules

·Mass production

SAW-WLP（RDL)

SAW-CSP

(E-less Ni/Au UBM+Solder ball)