产品优势:

 

·无需基板,可直接SMT在PCB板上

 

·晶圆级封装实现CSP,尺寸小,超薄

 

·低成本,高生产效率,高质量管控

 

晶圆级芯片封装 · WLCSP

Advantages:

 

·No substrate,can be directly attached to PCB

·Chip scale package

·Low cost,high efficiency for mass production High quality control

 

SAW-WLP/CSP Process Capability

 

SAW-CSP Chip

 

SAW-WLP Chip

 

SAW-WLP/CSP

WLP(RDL)

E-less Ni/Au UBM + Solder ball CSP