产品优势:
·无需基板,可直接SMT在PCB板上
·晶圆级封装实现CSP,尺寸小,超薄
·低成本,高生产效率,高质量管控
晶圆级芯片封装 · WLCSP
WLCSP-Bumping Process Capability
Advantages:
·No substrate,can be directly attached to PCB
·Chip scale package
·Low cost,high efficiency for mass production High quality control
Copper Pillar SEM
Solde Ball SEM
BUMPING
WLCSP(BGA/Cu Pillar)