产品优势:

 

·无需基板,可直接SMT在PCB板上

 

·晶圆级封装实现CSP,尺寸小,超薄

 

·低成本,高生产效率,高质量管控

 

晶圆级芯片封装 · WLCSP

WLCSP-Bumping Process Capability

 

Advantages:

 

·No substrate,can be directly attached to PCB

·Chip scale package

·Low cost,high efficiency for mass production High quality control

 

Copper Pillar SEM

 

Solde Ball SEM

BUMPING

WLCSP(BGA/Cu Pillar)