产品优势：

·提供1P1M，2P2M，3P3M等Cu Pillar Bump工艺，Bump最小节距30um;

·具有三种成熟的Solder Ball 工艺：钢网印刷、植球、电镀

晶圆级芯片封装 · WLCSP

WLCSP-Bumping Process Capability

Advantages：

·Provide 1P1M,2P2M,3P3M Cu Pillar Bump technology,the minimum Bump pitch is 30um;

·Capabale of three mature Solder Ball processes:Print、Ball Drop 、Plating

10mm Large die WLCSP

Thick Cooper RDL

BUMPING

WLCSP（RDL/UBM/Bump）

3P3M WLCSP

Multi-layer Fine L/S RDL